In your new role you will:Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realisation.Be
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
Job Responsibilities: Backend IC packaging turnkey solutions provider that include wafer bumping, wafer sort, assembly and testing. Expanded machine failure
In your new role you will: Observe and proactively act on trends in Package Innovation by having a sense of urgency for upcoming innovation and supporting
In your new role you will:Observe and proactively act on trends in Package Innovation by having a sense of urgency for upcoming innovation and supporting
In your new role you will: Observe and proactively act on trends in Package Innovation by having a sense of urgency for upcoming innovation and supporting
Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Supplier Quality
Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Packaging
Job summary AT&S Malaysia is seeking an experienced Process Engineer Mechanical (Operations) for its new production site in KulimThe role involves
Job DescriptionIntel's Advanced Design (AD) team is part of the larger Design Enablement (DE) organization that is focused on pathfinding and the development
The future. It's on you. You & Western Digital. We've been storing the world's data for more than 50 years. Once, it was the most important thing we could do
In your new role you will: Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key
Job Description- Perform failure analysis on assembly and test defect from packaging development and production and qualification on finished products (SSD).-
Company DescriptionThe future. It's on you. You & Western Digital.We've been storing the world's data for more than 50 years. Once, it was the most important
Job Description This position will interface with wafer fab, mainly NAND and ASIC, package & product design, electrical and physical characterization, lab
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionThe future. It’s on
In your new role you will:Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key
Job Description In your new role you will: Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until
In your new role you will: Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realisation. Be
In your new role you will: Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realisation. Be