In your new role you will:Develop and execute a comprehensive automation strategy that aligns with the organization's overall manufacturing objectives and
In your new role you will: Develop and execute a comprehensive automation strategy that aligns with the organization's overall manufacturing objectives and
In your new role you will:Develop and execute a comprehensive automation strategy that aligns with the organization's overall manufacturing objectives and
In your new role you will:Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc)
In your new role you will:Responsible for package design tasks in OSAT segment which specialsingin Power Module construction and design of SiC and IGBT
In your new role you will: Responsible for package design tasks in OSAT segment which specialsingin Power Module construction and design of SiC and IGBT
We are looking for a motivated, proactive, self-starting, analytical, problem solver to join our fast-paced environment. You will need to be very detail
In your new role you will:Develop and implement strategies to increase efficiency within the organizationAnalyze and evaluate existing processes and procedures
In your new role you will:Key member in Package development projects. Cost Per Piece (CPP)accountability & Project support and scheduling (Suppliers) – On
In your new role you will: Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc)
In your new role you will: Key member in Package development projects. Cost Per Piece (CPP)accountability & Project support and scheduling (Suppliers) – On
In your new role you will:Responsible for package design tasks in OSAT segment which specialsingin Power Module construction and design of SiC and IGBT
As technical expert, actively participate in the FE/BE overarching strategy definition and implementation concerning the interaction of wafer technology (chip
As technical expert, actively participate in the FE/BE overarching strategy definition and implementation concerning the interaction of wafer technology (chip
In your new role you will: Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.)
In your new role you will: Test package generation for new products with highercomplexity(software & hardware development). Test package optimization &
In your new role you will: Test package generation for new products with highercomplexity(software & hardware development). Test package optimization &
In your new role you will:Test package generation for new products with highercomplexity(software & hardware development).Test package optimization &
In your new role you will:Test package generation for new products with highercomplexity(software & hardware development).Test package optimization &
We are looking for a motivated, proactive, self-starting, analytical, problem solver to join our fast-paced environment. You will need to be very detail