We are searching for an expert PGDM Module Engineer (Wet Etch) to join our knowledgeable team at Intel Corporation in Malaysia. Growing your career as a Full
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to the development of Intel's newest Advanced Packaging technologies Work on Litho
Requirement -Diploma/ Degree in Electronic/Electrical Engineering Technology or equivalent and demonstrated experience -Ability to interpret engineering design
Wireless Communication Solutions (WCS), part of Client Computing Group/Client Platform Engineering, is a world-class leader in wireless connectivity and the
Req ID: Remote Position: NoRegion: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General OverviewFunctional Area: Supply Chain Management
Job summary As an Industrial Engineer at Bruker Nano, you will work closely with the manufacturing operation of Bruker Penang. You will be responsible for
Req ID: 118001 Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang **General Overview**: Functional Area: Supply Chain
Full-timeBusiness Function: Process EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
We are in need of a focused Process and Equipment Engineer to join our diverse team at Intel Corporation in Malaysia. Growing your career as a Full Time
Intern-LBU COB Product Development Penang, Malaysia **Who We Are**: **_Together with its customers, Lumileds is making the world better, safer, more
Sr Field Quality Engineer page is loadedSr Field Quality Engineer Apply locations Penang time type Full time posted on Posted 2 Days Ago job requisition id
Penang Advanced Packaging Lithography Install and Qual Specialist page is loadedPenang Advanced Packaging Lithography Install and Qual Specialist Apply
PGDM Module Engineer (Die Aggregation) page is loadedPGDM Module Engineer (Die Aggregation) Apply locations Malaysia, Penang time type Full time posted on
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionThe future. It’s on
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to Intel's vision of extending computing technology to every person on Earth. Report
Requirement -Diploma/ Degree in Electronic/Electrical Engineering Technology or equivalent and demonstrated experience -Ability to interpret engineering design
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionThe future. It’s on
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our