Job description About MDG: The Microcontrollers & Digital ICs Group (MDG) is at the heart of ST's strategy for safer and smarter embedded technology in the
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description · To setup Laser Process. · To develop and to industrialize assembly laser process for new packages, introduce materials to meet the quality,
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
Job description Responsibilities: Responsible for equipment benchmarking, technical strategies and technical support at Central Backend Manufacturing &
Job description Test Development : a) Feasibility study on conversion projects from legacy platform to newer tester platform. Liaise with division on
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,
Job Description - Follow Route Planning for delivery and collection operations - Warehouse loading & unloading jobs involved preparation, inspection and
Job description Responsibilities: · Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for
Job description Da Vinci Assembly Equipment Engineer · Evaluate and recommends equipment improvements to improve availability, capability and yield. ·
Job description About MDG: The Microcontrollers & Digital ICs Group (MDG) is at the heart of ST's strategy for safer and smarter embedded technology in the
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description · To setup Laser Process. · To develop and to industrialize assembly laser process for new packages, introduce materials to meet the quality,
Job description Responsibilities: Responsible for equipment benchmarking, technical strategies and technical support at Central Backend Manufacturing &
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,