Success Starts HereAs a leading global supplier of wafer fabrication equipment and services to the semiconductor industry, Lam Research develops innovative
In your new role you will: • Perform process transfer, process development, optimization and qualification for technology transfer and/or used tool transfer.
We are eager to add a remarkable Manufacturing System Engineer to join our collaborative team at Intel Corporation in Malaysia. Growing your career as a Full
We are searching for a focused Development Tools Software Engineer to join our amazing team at Intel Corporation in Malaysia. Growing your career as a Full
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
In your new role you will: Perform process transfer, process development, optimization and qualification for technology transfer and/or used tool transfer.
In your new role you will: Be responsible for the joint development of power GaN Technologies in collaboration with the technology development group including
In your new role you will: Initiate/lead yield/DD and quality improvement programs Digital image analysis and advanced analytics for wafer level
Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim Summary The Lead Engineer, Test Manufacturing accepts, transfers,
In your new role you will: Technical Lead process engineering and production support for one selected assigned area in semiconductor. Drive quality KPI, solve
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: > Knowledge in thinning process tools such as Taping, Detaping, Glass mounting and back grinding will be take as advantage. >
In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2. Drive quality KPI,
In your new role you will: Responsible for new technology transfer, production setup & qualify running in Kulim plant as well as ramp. Drive integration and
In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2. Drive quality KPI,