In your new role you will: Responsibilities with competency level and technical expertise acquired through professional experience on the job according to
In your new role you will: Perform process engineering and production support in one selected assigned area of semiconductor process (Metrology). Work as a
Job ResponsibilitiesThis position will be supporting our customer whom is located in Kulim. He/She will be responsible for providing quality repair and
In your new role you will: Be responsible for the joint development of power GaN Technologies in collaboration with the technology development group including
In your new role you will: Initiate/lead yield/DD and quality improvement programs Digital image analysis and advanced analytics for wafer level
Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim Summary The Lead Engineer, Test Manufacturing accepts, transfers,
In your new role you will: Technical Lead process engineering and production support for one selected assigned area in semiconductor. Drive quality KPI, solve
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and
In your new role you will: • Perform process engineering and production support in one selected assigned area of semiconductor process. • Work as a team
In your new role you will: • Perform electrical measurement and characterization in the lab • Perform inline wafer inspection and inline data
In your new role you will: o Each trainee must follow and complete the compulsory training defined by module or department. o Perform Preventive Maintenance
**Date**:22 Feb 2024**Location**: Kulim, 02, MY**Company**:Teleflex**Expected Travel**: None**Requisition ID**: 9886**About Teleflex Incorporated****Global
In your new role you will: > Knowledge in thinning process tools such as Taping, Detaping, Glass mounting and back grinding will be take as advantage. >
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
We are on the lookout for a capable Senior Staff Engineer Failure Analysis to join our knowledgeable team at Infineon Technologies AG in Kulim, Kedah. Growing
In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2. Drive quality KPI,
In your new role you will: • Perform process engineering and production support in one selected assigned area of semiconductor process. • Work as a team
In your new role you will: Fab layout planning, updating layout drawing, maintaining tool list update Floor marking & tool location confirmation during
In your new role you will: Responsible for new technology transfer, production setup & qualify running in Kulim plant as well as ramp. Drive integration and