As technical expert, actively participate in the FE/BE overarching strategy definition and implementation concerning the interaction of wafer technology (chip
In your new role you will: Test package generation for new products with highercomplexity(software & hardware development). Test package optimization &
In your new role you will: Key member in Package development projects. Cost Per Piece (CPP)accountability & Project support and scheduling (Suppliers) – On
Are you inspired to embark on a comprehensive AI journey? Do you have a startup mindset and always take challenges in your passion? If you do, we have just the
In your new role you will: Test package generation for new products with highercomplexity(software & hardware development). Test package optimization &
In your new role you will:Test package generation for new products with highercomplexity(software & hardware development).Test package optimization &
In your new role you will:Drive leadframe material development activities to ensure the package fulfill all requirement in the aspect of manufacturing, product
In your new role you will: Drive leadframe material development activities to ensure the package fulfill all requirement in the aspect of manufacturing,
Job Description In your new role you will: Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project
VacancyDescription Assist in the maintenance of plant and machinery's to ensure reliability and minimize breakdown. Operate, maintain, troubleshoot and repair
Job Description In your new role you will: Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project
Job DescriptionIn your new role you will:Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project
Job DescriptionIn your new role you will:Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification,
Job Description In your new role you will: Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project
Job Description In your new role you will: Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project
As technical expert, actively participate in the FE/BE overarching strategy definition and implementation concerning the interaction of wafer technology (chip
In your new role you will:Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc)
In your new role you will:Responsible to drive optimization & improvement to Facility Management& Control System (FMCS) & electrical system contribute toward
In your new role you will:Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.)
In your new role you will:Perform technical expert for lead frame / packing material in package development projects.Perform design, drawing and specification