Job description About MDG: The Microcontrollers & Digital ICs Group (MDG) is at the heart of ST's strategy for safer and smarter embedded technology in the
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description · To setup Laser Process. · To develop and to industrialize assembly laser process for new packages, introduce materials to meet the quality,
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,
Job description Responsibilities: · Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description · To setup Laser Process. · To develop and to industrialize assembly laser process for new packages, introduce materials to meet the quality,
Job Function Service Engineer Industry Manufacturing(Electronics/Semiconductors) Job Description - Internal communication with Japanese is required to
Job description About MDG: The Microcontrollers & Digital ICs Group (MDG) is at the heart of ST's strategy for safer and smarter embedded technology in the
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,
Job Function Service Engineer Industry Manufacturing(Electronics/Semiconductors) Job Description - Internal communication with Japanese is required to
Job FunctionService EngineerIndustryManufacturing(Electronics/Semiconductors)Job Description- Internal communication with Japanese is required to understand
Job description Responsibilities: · Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description Responsibilities:. Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for project
Job Function Software Engineer, Project Manager Industry IT/Telecommunications, Manufacturing(Electronics/Semiconductors) Job Description The selected