Job DescriptionResponsible for Test Handler, Tester & Test Socket at TOPResponsible for equipment incurred Quality Incident Investigation & CAPATroubleshoot &
Job DescriptionResponsible for Wire Bond KNS Rapid MEMS, ICONN+ , ICONN, ULTRA, Plasma Vision Semicon and Goldwire Management System.Responsible for equipment
Job Description Responsibilities: Perform electrical failure analysis for Manufacturing / Quality & customer failure drives for both NPI and sustaining
Job Description Perform package and device analysis on assembly test defect from production and qualification on semi-finished or finished products. Define FA
Job Description Responsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module
Job Description Identify/collect the data through deep understanding of MFG process and Equipment Define required data structure and data storage strategy.
Job DescriptionIdentify/collect the data through deep understanding of MFG process and EquipmentDefine required data structure and data storage strategy.
Job DescriptionJob DescriptionResponsible for NAND flash memory test program development/improvement, failure analysis and device issue debug.Responsible to
Job DescriptionPerform package and device analysis on assembly test defect from production and qualification on semi-finished or finished products. Define FA
Job DescriptionIdentify/collect the data through deep understanding of MFG process and EquipmentDesign data visualization to have an easy way to access the
Job Description.Responsible for development of Business Intelligence (BI) on Data Visualization, Analytics, Reporting, Dashboards and Data Integration with BI
Job DescriptionResponsible for Die Prep New Process Development and Equipment solutions to meet Quality, Cost, UPH, and Development targets (Process Module
Job DescriptionResponsible for TOWA PMC2023/PMC 1040D Compress Mold, TOWA YPS2060 Transfer Mold, Micromlex X-Ray machine, VisionSemicon Plasma machine, Sonic
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once
Job DescriptionCoach the lean six sigmato use the appropriated tools and techniques with DMAIC/DMADV methodology.Organize and facilitate workshop to identify
Job DescriptionExperience in new process start up, Willing to work as a team and collaborate with other functional teams to bring up the business process to
Job DescriptionCoaches the Lean Six Sigmato use the appropriated tools and techniques with DMAIC/DMADV methodology.Organizes and facilitates workshop to
Job DescriptionBe responsible for BGA , RPG Product and Package Qual / Rel tests setup / eFA / Action Plan.Provide correct test conditions for advanced
Job DescriptionDiscuss with business owner to identify the critical data and understand MFG processDevelop MFG process fault model and implement into line
Job DescriptionMachine trouble shoot and maintenance.Documents (OCAP/FMEA/WI/Equipment/Training materialgeneration, update and maintenance.Line abnormalities,