Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once
Responsibilities: - Manage all quality department operational metrics and drive continuous improvement including quality control, FA Lab, QMS and EHS. -
Our vision is to transform how the world uses information to enrich life forall. Micron Technology is a world leader in innovating memory and storage solutions
Module R&D NPI programs in product and process development Experience Required 2 - 5 Years Industry Type IT Employment Type Permanent Location Malaysia
Job DescriptionJob Summary:As a Staff/Principal Engineer in the Equipment Development Department for Flash Drive Manufacturing, you'll be instrumental in
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage
Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Manufacturing Equipment
We are eager to add an enthusiastic Principal Engineer, Chip and Package Integration to join our amazing team at Western Digital in Perai, Pulau Pinang.
In your new role you will:1) Perform IC (complex functional) Failure Analysis (FA) on wafer and package level starting from electrical verification, fault
In your new role you will: 1) Perform IC (complex functional) Failure Analysis (FA) on wafer and package level starting from electrical verification, fault
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once
Job Description Job Summary: As a Staff/Principal Engineer in the Equipment Development Department for Flash Drive Manufacturing, you'll be instrumental in
Position:PIP Quality Engineer Department:Operations Location:Penang Malaysia Description: The PIP(Perfect Installation Program) quality engineer will be
In your new role you will:1) Perform IC (complex functional) Failure Analysis [FA] on wafer and package level starting from electrical verification, fault
JOB REQUIREMENTS: Master or BS Degree in Engineering in Electronics or Communication. Minimum 3 years of experience in PCBA/PCB engineering and supplier
JOB REQUIREMENTS: Master or BS Degree in Engineering in Electronics or Communication. Minimum 3 years of experience in PCBA/PCB engineering and supplier
**Responsibilities**: - Manage all quality department operational metrics and drive continuous improvement including quality control, FA Lab, QMS and EHS. -
Job DescriptionResponsible for New Wafer Technology integration into New Package Development.Define Chip-to-Package process, mechanical, thermal, reliability
Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Packaging