Job Overview: General Description includes complex mechanical engineering design, analysis and development of an assigned scope of work in a CB&I project
Our client is currently seeking for candidates with strong EPCC experience to join their new project as Senior Site Rotating Engineer.Job
Duties and Responsibilities · To design, coordinate, supervise, implement etc of mechanical building services (HVAC, Process Utilities, Fire
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once
Job Description Key Responsibilities: - Design and development of mechanical parts include plastic injection molding tray, machining pallet, jig, fixture for
Requirements: Bachelor's degree majoring in Building Electrical, Automation, Mechanical and Electrical, or equivalent. At least 5 years of experience as an
Organization & RoleTeradyne is a global technology company delivering industry-leading ATE (Automated Test Equipment) solutions for customers around the
Job DescriptionLead and improve product quality and process efficiency via systematic methodologies such as LEAN 6 Sigma to achieve optimum operation
Job Responsibilities: Conferring with customers, engineers, and others to discuss existing or potential engineering products or projects. Ensuring that
Selangor, MalaysiaJob Family Group:Maintenance, Reliability and TurnaroundsWorker Type:RegularPosting Start Date:Business unit:Experience Level: Early
Responsibilities: - Responsible for leading a project, overall activities and supervising a team of engineers, including liaising with other internal
Residue Fluid Catalytic Cracking (RFCC) Operation Engineer or Specialist Position Skilled professional with extensive experience in refining processes,
In your new role you will:Define and develop the right package for new products/technologies from BU/FE from concept, feasibility study until realisation.Be
Responsibilities: Lead process development activities which includes designing of the process and equipment, evaluating and optimizing the product design and
The relationship with our client started in 2009 and has been growing globally within the IFM sector, extensively covering EMEA and APAC, while recently
At Precision Control, career advancement is one of our top priorities. A successful company needs a successful team & that is what we aim to build. If you are
Job Description Responsible for Flip Chip Die Attach & Under Fill New Process Development for new product and new process development. Supports New Product
In your new role you will: Prepare specimens for optical, cross-section and Scanning Electron Microscope [SEM] examination (XSEM job). Use the Scanning
Job Summary Produce the mechanical / electrical design from concept to detail design. Responsible for the design contents as assigned together with its
Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once