Job description Our client is a Multinational Semiconductor manufacturer in Malacca. Due to rapid expansion, they are seeking a Quality Assurance & Quality
In your new role you will:Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc)
Job description My client in Malacca is a global semiconductor MNC which is seeking a Test Engineer to join their team. Key Responsibilities: Lead Test
In your new role you will: Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc)
In your new role you will: Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.)
In your new role you will:Be the driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.)
In your new role you will:Responsible for process quality on equipment/process levelResponsible for self contain improvement in responsible package lineEnsure
In your new role you will:Apply your technical knowledge within own optimization projects or as project team member of development projects with FE/BE and
As technical expert, actively participate in the FE/BE overarching strategy definition and implementation concerning the interaction of wafer technology (chip
To support Process EngineeringIn your new role you will: Responsible for process quality on equipment/process level Responsible for self contain improvement in
Support Test Process Engineering (Lead Trim /Test / Mark Scan Pack)In your new role you will: Responsible for process quality on equipment/process level
In your new role you will:Responsible for PBC and TPC assessment. Be the owner of Risk Interaction assessment and mitigation work packagesIntegration ownership
In your new role you will:Responsible for process quality on equipment/process level Responsible for self contain improvement in responsible package lineEnsure
In your new role you will:Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and
Harmonize cross platform Technology Integration activities and drive synergy through best practice implementation. TI roles in over arching technology projects
Wire Bond experts, responsible to achieve robust and auto-pilot processesIn your new role you will: Sustains and continuously improves qualified technologies
?Perform technical expert for lead frame / packing material in package development projects.In your new role you will: Perform t echnical expert for lead frame
In your new role you will:Perform technical expert for lead frame / packing material in package development projects.Perform design, drawing and specification
In your new role you will:Responsible for the project's success (scope, budget, time, quality, delivery).To drive and manage project business case.To setup
To plan, manage and drive timely completion of projects including new package & product derivates ramp up, FE wafer technology transfer and conversion and