Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Company Description- Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd, with offices located in Selangor and Penang. In
THE ROLE:Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
Established in January 2014, Kaifa Technology Malaysia Sdn. Bhd (Kaifa Malaysia) is a wholly-owned subsidiary of Shenzhen Kaifa Technology Co., Ltd. (Kaifa,
Responsible for repairs/troubleshooting of mechanical & electrical assemblies within the manufacturing operation. - Assists with the installation, debug and
WHAT YOU DO AT AMD CHANGES EVERYTHING We care deeply about transforming lives with AMD technology to enrich our industry, our communities, and the world. Our
Company DescriptionBosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd, with offices located in Selangor and Penang. In
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionThe future. It’s on
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
We are searching for an energetic Sales and Application Manager to join our innovative team at Test Tooling Solutions Group in Bayan Lepas, Pulau Pinang.
Job DescriptionIntel's recently announced IDM strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and willing
Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Packaging
We are on the lookout for an energetic Mechanical Engineer to join our growing team at Teradyne in Bayan Lepas, Pulau Pinang. Growing your career as a Full
Company Description - Bosch has been present in Malaysia since 1923, represented by Robert Bosch Sdn Bhd, with offices located in Selangor and Penang. In
We are searching for an expert PGDM Module Engineer (Wet Etch) to join our knowledgeable team at Intel Corporation in Malaysia. Growing your career as a Full
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to the development of Intel's newest Advanced Packaging technologies Work on Litho
THE ROLE:Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
We are searching for a hardworking Production Maintenance Engineer to join our passionate team at Monroe Consulting Group in Malaysia. Growing your career as a
Job summary Recruiting for a global MNC in industrial packaging solutions Looking for an experienced QA Engineer to ensure product quality Based in Penang and
We are in need of a focused Process and Equipment Engineer to join our diverse team at Intel Corporation in Malaysia. Growing your career as a Full Time