Job summary PGDM Module Engineer (Plating) Full time Malaysia, Penang Job seniority:mid-to-senior level Responsibilities • Provide Process and Equipment
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to the development of Intel's newest Advanced Packaging technologies Work on Litho
Responsibilities: ·Responsible to promote and sell company's products/services/solutions to existing and new customers to achieve personal sales
**Repair Technician (Capital Equipment)**: - Remote Eligible: Onsite- Onsite Location(s): Pulau, Penang, MY**Location**: city, stateProvince, country
Overview As one of the world's leading analytical instrumentation companies, Bruker Corporation covers a broad spectrum of advanced solutions in all fields of
Keysight is on the forefront of technology innovation, delivering breakthroughs and trusted insights to the world's visionaries and innovators in electronic
We are searching for a hardworking Production Maintenance Engineer to join our passionate team at Monroe Consulting Group in Malaysia. Growing your career as a
Sr Field Quality Engineer page is loadedSr Field Quality Engineer Apply locations Penang time type Full time posted on Posted 2 Days Ago job requisition id
Penang Advanced Packaging Lithography Install and Qual Specialist page is loadedPenang Advanced Packaging Lithography Install and Qual Specialist Apply
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionThe future. It’s on
Duties & Responsibilities Base in Penang, Malaysia. Provide technical support to the Contract Manufacturer for executing the assembly processes, ECN
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to Intel's vision of extending computing technology to every person on Earth. Report
What you will do:Acts as on-site project leader to plan, implement, and complete assigned projects. Delegate tasks to implement and fully complete assigned
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionThe future. It’s on
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Hardware Engineer Intern – Analog/Digital (EE) You will be assigned an insightful mentor, who will guide you through your project and work term for a
Job summary PGDM Module Engineer (C4 TSV Thin Film) Full-time position in Malaysia, Penang Responsible for process and equipment engineering in Advanced
Flex, a Fortune global 500 company, is the diversified manufacturing partner of choice that helps market-leading brands design, build and deliver innovative