Jawatan Kosong di Intel Technology Sdn. Bhd. Tawaran adalah dipelawa daripada Warganegara Malaysia yang berkelayakan untuk memohon bagi mengisi jawatan
Job DescriptionIntel's recently announced IDM strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and willing
Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Packaging
We are searching for a remarkable Product Development Engineer to join our dedicated team at Intel Corporation in Malaysia. Growing your career as a Full Time
THE ROLE:As a Senior Product Development engineer, you will collaborate with various Product Development Groups. This individual serves as a critical technical
We are on the lookout for an energetic Mechanical Engineer to join our growing team at Teradyne in Bayan Lepas, Pulau Pinang. Growing your career as a Full
Full-timeJob Type (exemption status): Exempt position - Please see related compensation & benefits details belowBusiness Function: Data Management
We are searching for an expert PGDM Module Engineer (Wet Etch) to join our knowledgeable team at Intel Corporation in Malaysia. Growing your career as a Full
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to the development of Intel's newest Advanced Packaging technologies Work on Litho
THE ROLE:As a Senior Product Development engineer, you will collaborate with various Product Development Groups. This individual serves as a critical technical
THE ROLE:Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
THE ROLE Be part of a dynamic team performing electrical validation of DC GPU SoC Post-Silicon IO interface, in a way that is end to end customer focused,
We are in need of a focused Process and Equipment Engineer to join our diverse team at Intel Corporation in Malaysia. Growing your career as a Full Time
Penang Advanced Packaging Lithography Install and Qual Specialist page is loadedPenang Advanced Packaging Lithography Install and Qual Specialist Apply
PGDM Module Engineer (Die Aggregation) page is loadedPGDM Module Engineer (Die Aggregation) Apply locations Malaysia, Penang time type Full time posted on
PGDM Advanced Packaging Industrial Engineering page is loadedPGDM Advanced Packaging Industrial Engineering Apply locations Malaysia, Penang time type Full
Construction Environmental Health Safety Engineer page is loadedConstruction Environmental Health Safety Engineer Apply locations Malaysia, Penang time type
Facilities Total Gas and Chemical Management System (TGCM) Engineer page is loadedFacilities Total Gas and Chemical Management System (TGCM) Engineer Apply
Job summary PGDM Module Engineer (C4 TSV Thin Film) Full-time position in Malaysia, Penang Responsible for process and equipment engineering in Advanced
THE ROLE: As a Senior Product Development engineer, you will collaborate with various Product Development Groups. This individual serves as a critical