Job DescriptionResponsible for planning & implementation of best manufacturing/production systemTo lead the whole production team & drive operations
Job DescriptionWe are seeking students pursuing internship with expertise in Machine Learning and Deep Learning algorithms to join our team. As an AI Intern,
Job DescriptionWire Bond Equipment EngineerResponsible for Wire Bond KNS Rapid MEMS, ICONN+ , ICONN, ULTRA, Plasma Vision Semicon and Goldwire Management
Job DescriptionIntern under Product Development Teamwill be responsible for assisting engineers in respective Memory (NAND) & Platform (SSD) Test Development
Job DescriptionLeading a team of Lean Six Sigma (OE) Coaches on Continuous Improvement implementation using Lean Six Sigma methodology, focusing on 3 pillars:
Job DescriptionKey focus on electrical design and hands on support for electrical system, especially in maintenance & switching for HT up to 132KV.Support REO
Job DescriptionRole Overview: We are seeking a dynamic and strategic Senior Supervisor for our People Operations team in Malaysia. As the Sr. Supervisor of
Job DescriptionTroubleshoot machine issue, working on improvement and upgrade current machine performanceData collection, running DOE, GRR, linearity test etc
Job DescriptionThis position will interface with wafer fab, mainly NAND and ASIC, package & product design, electrical and physical characterization, lab
Job DescriptionLead the development of innovative data science solutions to a variety of business problems.Design and implement data analysis, machine
Job DescriptionProvides technical assistance to engineering personnel for material development, failure analysis as requiredWorks with material engineers to
Job DescriptionKey Responsibilities:Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety
Job DescriptionSustain and Monitor all Tester repair and maintenance by ensure the quality and efficiency of the assigned machine in production.Ensure correct
Job DescriptionPredict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilitiesDesign and
Job DescriptionPlan and conduct for the DOE executions for all SSD improvement task force for mechanical assembly processParticipate in DFMA (Design for
Job DescriptionAssist in continuous improvements (CI) workshops and follow up the CI projects progressively.Conduct research and gather data to support project
Job Description1.0 Assisting wire bond process engineer on key wire bond improvement projects.2.0 Wire bond critical to quality item process control3.0 Work
Job Description-Coordinate of process development and manufacturing for NPI project, include: generate SOW, specification, design implementation, buyoff
Job DescriptionThis position will interface with wafer fab, mainly NAND and ASIC, package & product design, electrical and physical characterization, lab
Job DescriptionWE are looking for Business Application Analyst 3 with good understanding and knowledge in in .NET (C# and VB), Web Service, Web development,