Job Description In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect
In your new role you will: Initiate/lead yield/DD and quality improvement programs Digital image analysis and advanced analytics for wafer level
Job ResponsibilitiesThis position will be supporting our customer whom is located in Kulim. He/She will be responsible for providing quality repair and
In your new role you will: Be responsible for the joint development of power GaN Technologies in collaboration with the technology development group including
Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim Summary The Lead Engineer, Test Manufacturing accepts, transfers,
In your new role you will: Technical Lead process engineering and production support for one selected assigned area in semiconductor. Drive quality KPI, solve
Job Description In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2.
Job Description In your new role you will: . Perform process engineering and production support in one selected assigned area of semiconductor process. . Work
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: • Perform process engineering and production support in one selected assigned area of semiconductor process. • Work as a team
In your new role you will: Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and
In your new role you will: o Each trainee must follow and complete the compulsory training defined by module or department. o Perform Preventive Maintenance
Job Description SummaryInspect boiler operation and carry out minor repairs on boiler. Perform duties and responsible for boiler operation, related maintenance
Job Description In your new role you will: Perform process engineering and production support in one selected assigned area of semiconductor process Lead,
**Date**:22 Feb 2024**Location**: Kulim, 02, MY**Company**:Teleflex**Expected Travel**: None**Requisition ID**: 9886**About Teleflex Incorporated****Global
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: > Knowledge in thinning process tools such as Taping, Detaping, Glass mounting and back grinding will be take as advantage. >
**Job Descriptions**:1. Administrative work:¦ Assist to organize project customer visit(schedule, transportation, accommodation, working lunch, meeting room
Location : KulimIndustry : Roofing & Construction industry (CIDB needed)Skills **:Degree in QS, Minimum 6 years in Construction industry, CIDB, Able to work on
In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2. Drive quality KPI,