Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Job summary PGDM Module Engineer Contract (Singulation / Pick and Place) Penang, Malaysia Intel's Advanced Packaging manufacturing facility in Malaysia Job
Job summary PGDM Module Engineer (C4 TSV Thin Film) Full-time position in Malaysia, Penang Responsible for process and equipment engineering in Advanced
To support our team in PacTech Asia in Malaysia, we are looking for a Quality Assistant (M/F/d) for the next possible date. **About PacTech** - Inspection on
Job summary PGDM Module Engineer Contract (Singulation / Pick and Place) Malaysia, Penang Full time Job seniority:entry level Responsibilities • Be part of
THE ROLE: As a Senior Product Development engineer, you will collaborate with various Product Development Groups. This individual serves as a critical
Join Nexperia and connect your unique talents and passion to your goals for a fulfilling career with growth and reward. We are a global semiconductor
JLL supports the Whole You, personally and professionally. We are committed to hiring the best, most talented people in our industry, and then empowering them
THE ROLE:As a Senior Product Development engineer, you will collaborate with various Product Development Groups. This individual serves as a critical technical
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to the development of Intel's newest Advanced Packaging technologies Work on Litho
We are on the lookout for a creative Principal Process Engineer to join our fast-paced team at ENOVIX Corporation in Pulau Pinang. Growing your career as a
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
THE ROLE:Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
THE ROLE: Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
THE ROLE:Be part of a dynamic team performing electrical validation of Datacenter Server SoC Post-Silicon IO interface, in a way that is end to end customer
THE ROLE Be part of a dynamic team performing electrical validation of DC GPU SoC Post-Silicon IO interface, in a way that is end to end customer focused,
THE ROLE Be part of a dynamic team performing electrical validation of DC GPU SoC Post-Silicon IO interface, in a way that is end to end customer focused,
THE ROLE: Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
Join Nexperia and connect your unique talents and passion to your goals for a fulfilling career with growth and reward. We are a global semiconductor
Full-timeBusiness Function: Process EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionThe future. It’s on you.