In your new role you will:Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and
In your new role you will:Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc)
In your new role you will:Provide 2nd level support for Backend Capacity Planning (BE CPL) application.Change request management for BE CPL application :
?Perform technical expert for lead frame / packing material in package development projects.In your new role you will: Perform t echnical expert for lead frame
In your new role you will:Responsible for the project's success (scope, budget, time, quality, delivery).To drive and manage project business case.To setup
To plan, manage and drive timely completion of projects including new package & product derivates ramp up, FE wafer technology transfer and conversion and
Wire Bond experts, responsible to achieve robust and auto-pilot processesIn your new role you will: Sustains and continuously improves qualified technologies
In your new role you will: Responsible for the project's success (scope, budget, time, quality, delivery). To drive and manage project business case. To setup
Utilize your advanced knowledge of mechanical engineering principles to conceptualize and create innovative designs for various products and systems.
To plan, manage and drive timely completion of projects including new package & product derivates ramp up, FE wafer technology transfer and conversion and
We are desiring to recruit a confident Senior Engineer Development Leadframe to join our innovative team at Infineon Technologies AG in Malacca City, Malacca.
Wire Bond experts, responsible to achieve robust and auto-pilot processesIn your new role you will:Sustains and continuously improves qualified technologies in
In your new role you will: Perform t echnical expert for lead frame / packing material in package development projects. Perform design, drawing and
In your new role you will: Test package generation for new products with higher complexity(software & hardware development). Test package optimization &
In your new role you will: Test Scan Pack (TSP) handling platform equipment development Responsible for execution and establish test scan pack handling
In your new role you will: Provide 2nd level support for Backend Capacity Planning (BE CPL) application . Change request management for BE CPL application :
In your new role you will: Develop and drive equipment digital transformation strategy androadmap Collaborate with various functions to define and
In your new role you will: Act as the Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc)
We can't predict what the future holds, but we know Texas Instruments will have a part in shaping it.Texas Instruments (TI) Government Relations represents the
Powering Positive Change™ In a world of constant change, the only way to make a meaningful impact is to stay ahead of the curve. That's why at Maxeon Solar