Job summary Recruiting for a global MNC in industrial packaging solutions Looking for an experienced QA Engineer to ensure product quality Based in Penang and
13th December, 2023 Purpose of the position Managing customer's expectation and develop new businesses to maximize profits. Enforcing existing supply
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to Intel's vision of extending computing technology to every person on Earth. Report
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Full-timeBusiness Function: Packaging EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital, our
Nezda is currently looking for Senior Hardware Engineer/Staff (HPS). Salary: RM 9,000 Qualifications: ? Degree in Electronics Engineering or equivalent,
15-Nov-2023 Maintenance Engineer (Open) AS-MY-Prai Job Description and Qualifications Job Description Summary This position supports all operating sites in
Job summary PGDM Module Engineer (C4 TSV Thin Film) Full-time position in Malaysia, Penang Responsible for process and equipment engineering in Advanced
Job summary Customer Support Engineer (based in Penang) Field service activities associated with troubleshooting, diagnostic and repairing highly complex
•Knowledgeable and Experienced in multiple phases of the Plexus product realization process which includes - Conceptualize, Design, Commercialize,
Req ID: Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career
Full-timeBusiness Function: Manufacturing EngineeringWork Location: Penang SDSM Office--LOC_SNDK_Seberang Perai Office Company DescriptionAt Western Digital,
Req ID: Remote Position: NoRegion: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General OverviewFunctional Area: Engineering Career Stream:
Job summary Join the Intel Malaysia Advanced Packaging team and contribute to the development of Intel's newest Advanced Packaging technologies Work on Litho
Req ID: Remote Position: No Region: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General Overview Functional Area: Engineering Career
Req ID: Remote Position: NoRegion: Asia Country: Malaysia State/Province: Bayan Lepas City: Penang General OverviewFunctional Area: Engineering Career Stream:
Company Description At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once
THE ROLE:Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
THE ROLE: Being in External Manufacturing Operations (Backend Engineering), candidate is required to drive supplier engagement in external Flip Chip
Job summary Mechanical Design Manager in Automation Field Work in the Penang, Malaysia office Responsible for conceptual and actual design for machine