Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description Responsibilities: · Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for
Job descriptionResponsibilities:· Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for project
Job description Da Vinci Assembly Equipment Engineer · Evaluate and recommends equipment improvements to improve availability, capability and yield. ·
Assembly Process Development Engineer - Laser Structuring/Laser Cut - STMicroelectronics Sdn Bhd - 5261962 | JobStreet JobStreet Login For employers Job search
Lead Engineer - STMicroelectronics Sdn Bhd - 1034681084 | JobStreet JobStreet Login For employers Job search MyJobStreet Company profiles Career advice New
Wire Bond Process Engineer - STMicroelectronics Sdn Bhd - 1034465520 | JobStreet JobStreet Login For employers Job search MyJobStreet Company profiles Career
Planning Engineer - Project & Programme Matters - 1034706918 | JobStreet JobStreet Login For employers Job search MyJobStreet Company profiles Career advice
The main mission of the jobholder will be: - Analysis of network, security and telecom architectures - Infrastructure support and coordination - Ensure on-call
Coordinate and support New Product Introduction, working closely with Division and to assure smooth deployment of new products into mass production. Ensure
Plating Process Development Engineer M/F Posting title Plating Process Development Engineer M/F Regular/Temporary Regular · To setup plating (Cu/Tin) process.
Assembly Process Development Engineer - Laser Structuring/Laser Cut M/F Posting title Assembly Process Development Engineer - Laser Structuring/Laser Cut M/F
To develop and to industrialize New material/ New process (Molding/ Package Sawing/ Trim & Form) for new package (eg: QFPs/ Power SSO/ Power SO/ HiQuad/ SOIC/
To contribute in ensuring new devices development and industrialization achieving highest possible production standards in order to maximize cost efficiency
· Evaluate and recommends equipment improvements to improve availability, capability and yield. · Perform equipment analyses (including preventive and
We are hiring an enthusiastic ELECTRICAL ENGINEER to join our awesome team at CEC ELECTRICAL ENGINEERING SDN. BHD. in Muar, Johor. Growing your career as a
Coordinate and support New Product Introduction, working closely with Division and to assure smooth deployment of new products into mass production.Ensure