In your new role you will: • Perform process transfer, process development, optimization and qualification for technology transfer and/or used tool transfer.
Job Details: Job Description: Drives technology development and enablement for both high volume manufacturing and future technology, provides process
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
In your new role you will: Perform process transfer, process development, optimization and qualification for technology transfer and/or used tool transfer.
In your new role you will: Responsibilities with competency level and technical expertise acquired through professional experience on the job according to
In your new role you will: Perform process engineering and production support in one selected assigned area of semiconductor process (Metrology). Work as a
Job ResponsibilitiesThis position will be supporting our customer whom is located in Kulim. He/She will be responsible for providing quality repair and
In your new role you will: Initiate/lead yield/DD and quality improvement programs Digital image analysis and advanced analytics for wafer level
In your new role you will: Technical Lead process engineering and production support for one selected assigned area in semiconductor. Drive quality KPI, solve
Remote Position: No Region: Asia Country: Malaysia State/Province: Kedah City: Kulim Summary The Lead Engineer, Test Manufacturing accepts, transfers,
Wafer Test related system development or enhancement which in the scope of analysis, design, develop, testing, deployment, operational support and
Job Description In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2.
Job Description In your new role you will: . Perform process engineering and production support in one selected assigned area of semiconductor process. . Work
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and
In your new role you will: • Perform process engineering and production support in one selected assigned area of semiconductor process. • Work as a team
In your new role you will: • Perform electrical measurement and characterization in the lab • Perform inline wafer inspection and inline data