Job Description In your new role you will: Be responsible for the joint development of power GaN Technologies in collaboration with the technology development
Be part of our team!AT&S, a world leading high-tech PCB & IC Substrates Company, with production plants in Austria, China, India, Korea; and Sales Support
In your new role you will: Perform process transfer, process development, optimization and qualification for technology transfer and/or used tool transfer.
In your new role you will: Be responsible for the joint development of power GaN Technologies in collaboration with the technology development group including
Job Description In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect
In your new role you will: Initiate/lead yield/DD and quality improvement programs Digital image analysis and advanced analytics for wafer level
In your new role you will: Technical Lead process engineering and production support for one selected assigned area in semiconductor. Drive quality KPI, solve
Wafer Test related system development or enhancement which in the scope of analysis, design, develop, testing, deployment, operational support and
Job Description Designs, develops, and executes power and performance plans for IPs and SoCs. Identifies, builds, and maintains power, thermal,
Job Description In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2.
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: > Knowledge in thinning process tools such as Taping, Detaping, Glass mounting and back grinding will be take as advantage. >
Job Description Designs, develops, and executes power and performance plans for IPs and SoCs. Identifies, builds, and maintains power, thermal,
In your new role you will: Responsible for new technology transfer, production setup & qualify running in Kulim plant as well as ramp. Drive integration and
In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2. Drive quality KPI,
In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2. Drive quality KPI,
In your new role you will: Responsible for new technology transfer, production setup & qualify running in Kulim plant as well as ramp. Drive integration and
In your new role you will:Responsible for new technology transfer, production setup & qualify running in Kulim plant as well as ramp.Drive integration and