Wire Bond Process Engineer

Job Description You will work as SSD (Solid State Drive) package integration engineer in packaging engineering group.Leads new SSD product development from

Process Development and Optimization:  Develop and optimize wire bonding processes for new and existing semiconductor packages (SIP, BGA, QFN, small package

We are seeking great talent to help us build The DNA of tech.®Vishay manufactures one of the world's largest portfolios of discrete semiconductors and passive

Responsible to develop a robust process and continuously drive & lead the team for improvement in yield and quality to meet KPI.In your new role you will:To

In your new role you will: To sustain, improve the process in order to deliver products to customers at committed functionality, reliability, time, volume and

In your new role you will: Develop and execute a comprehensive automation strategy that aligns with the organization's overall manufacturing objectives and

Job Type (exemption status): Exempt position - Please see related compensation & benefits details below Business Function: Process Engineering Company

Our vision is to transform how the world uses information to enrich life for all.Micron Technology is a world leader in innovating memory and storage solutions

Spare parts management on usage, budget control.and work on cost reductionsIn your new role you will:Trouble shoot and diagnose difficult, infrequent problems

Assembly Wirebond Process Engineer page is loaded Assembly Wirebond Process Engineer Apply locations Kuala Lumpur time type Full time posted on Posted

Responsible to develop a robust process and continuously drive & lead the team for improvement in yield and quality to meet KPI.In your new role you will:To

Company DescriptionAt Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once

Job Description1.0 Assisting wire bond process engineer on key wire bond improvement projects.2.0 Wire bond critical to quality item process control3.0 Work

Job DescriptionMaximize wire bond process capability to handle wide range of product portfolio.Drive for Wire Bond process yield improvement and

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage

Job DescriptionWire Bond Equipment EngineerResponsible for Wire Bond KNS Rapid MEMS, ICONN+ , ICONN, ULTRA, Plasma Vision Semicon and Goldwire Management

Job Description Maximize wire bond process capability to handle wide range of product portfolio.Drive for Wire Bond process yield improvement and