Remote Position: NoRegion: Asia Country: Malaysia State/Province: Kedah City: Kulim General OverviewJob Title: Lead Engineer, Test ManufacturingFunctional
Company :Inokom Corporation Sdn. Bhd.Develop, improve, implement and evaluation of integrated systems of people, cost, knowledge, information, equipment,
Job Pos ition: Production Support Engineer Job ID: 20240182 A(A45)AH Company Background: Semiconductor Manufacturer Salary Range: Basic up to MYR4,500 MYR6,000
In your new role you will: Drive the development of GaN power technologies in collaboration with application, product, TCAD simulation and reliability teams
In your new role you will: Lead process transfer, process development, optimization an qualification for technology transfer and/or used tool transfer
In your new role you will:Lead Process Integration engineers from various technologies in Device Process Control Monitoring (PCM) stability and capability
Job Pos ition: Production Support Engineer Job ID: ******** A(A45)AH Company Background: Semiconductor Manufacturer Salary Range: Basic up to MYR4,500 MYR6,000
Job Description In your new role you will: About the Team: We are a team of FI (Factory Integration) Global Manufacturing Reporting Solutions from Infineon.
In your new role you will: About the Team: We are a team of FI (Factory Integration) Global Manufacturing Reporting Solutions from Infineon. With in-depth
Job Description In your new role you will: Be responsible for the joint development of power GaN Technologies in collaboration with the technology development
Job Description In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect
In your new role you will: Be responsible for the joint development of power GaN Technologies in collaboration with the technology development group including
In your new role you will: Initiate/lead yield/DD and quality improvement programs Digital image analysis and advanced analytics for wafer level
In your new role you will: Technical Lead process engineering and production support for one selected assigned area in semiconductor. Drive quality KPI, solve
Job Description In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2.
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: Perform IC (complex functional) Failure Analysis [FA] on wafer and package level from electrical verification, fault isolation and
In your new role you will: Act as a lead Defect Density (DD) Engineer for the Wide Band Gap (WBG) technologies. Provide expertise in defect density engineering
In your new role you will: Responsible for new technology transfer, production setup & qualify running in Kulim plant as well as ramp. Drive integration and
In your new role you will: 1. Technical Lead process engineering and production support for one selected assigned area in semiconductor 2. Drive quality KPI,