Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
We are looking for a meticulous EPE Process Engineer to join our inspiring team at Micron in Muar, Johor. Growing your career as a Full Time EPE Process
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
We are seeking a brilliant Contamination Control Engineer to join our vibrant team at Micron in Muar, Johor. Growing your career as a Full Time Contamination
We are seeking an influential Assembly Equipment Engineer (semiconductor) to join our exceptional team at Micron in Muar, Johor. Growing your career as a Full
Job description Responsibilities: · Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description · To setup Laser Process. · To develop and to industrialize assembly laser process for new packages, introduce materials to meet the quality,
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
Job description Responsibilities: · Conduct paper study/benchmarking and physical evaluation of the best available equipment in the market suitable for
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,
Job description Responsibilities: · To setup pre-assy and die attached Process. · To develop and to industrialize pre-assy process including lamination,
Job description Responsibilities: · To setup dry etch and descum Process. · To develop and to industrialize dry etch and descum process, introduce materials
Job description · To setup Laser Process. · To develop and to industrialize assembly laser process for new packages, introduce materials to meet the quality,
Job description Responsibilities: · To setup descum and sputtering (Ti/Cu) Process. · To develop and to industrialize descum and sputtering (Ti/Cu) process,
Job description Responsibilities: · To setup Assembly Molding, Grinding Process, Panel release & RNT. · To develop and to industrialize assembly Molding,