Job DescriptionBackground: SanDisk's Penang SSD Platform Technology Development Integration (PTDI) organization is a SSD technology development group that will
Job Description-Coordinate of process development and manufacturing for NPI project, include: generate SOW, specification, design implementation, buyoff
Job DescriptionPlan and conduct for the DOE executions for all SSD improvement task force for mechanical assembly processParticipate in DFMA (Design for
Job DescriptionESSENTIAL DUTIES AND RESPONSIBILITIES:Leading New Product Development lot/Work-Order execution at SMT, Mechanical Assembly, and Backend of SSD
Job DescriptionThis position will interface with wafer fab, mainly NAND and ASIC, package & product design, electrical and physical characterization, lab
Job DescriptionManage and own Inspection process false call and yieldDrive inspection recipe enhancementEnsure inspection program are meeting quality out going
Job DescriptionManage and own Inspection process false call and yieldDrive inspection recipe enhancementEnsure inspection program are meeting quality out going
Job DescriptionESSENTIAL DUTIES AND RESPONSIBILITIES:Factory Capex planning base on the loading forecast, Capex budget control and monitoring on capital
Job DescriptionKey Responsibilities:Develops solutions to improve quality, reliability, cost, yield, process stability/capability, productivity, and safety
Job DescriptionSustain and Monitor all Tester repair and maintenance by ensure the quality and efficiency of the assigned machine in production.Ensure correct
Job Description.Provide mechanical simulations and solutions for advanced 3D NAND products.Predict and define structural risks and mechanisms using simulation
Job DescriptionWire Bond Equipment EngineerResponsible for Wire Bond KNS Rapid MEMS, ICONN+ , ICONN, ULTRA, Plasma Vision Semicon and Goldwire Management
Job Description- The Staff Engineer defines, develops and qualifies new semiconductor packages and maintains quality of existing packages.- Represents Package
Job DescriptionMaximize wire bond process capability to handle wide range of product portfolio.Drive for Wire Bond process yield improvement and
Job DescriptionTroubleshoot machine issue, working on improvement and upgrade current machine performanceData collection, running DOE, GRR, linearity test etc
Job DescriptionProvides technical assistance to engineering personnel for material development, failure analysis as requiredWorks with material engineers to
Job DescriptionPredict and define structural risks and mechanisms using simulation tools for electronic packaging design, assembly and reliabilitiesDesign and
Job Summary: The Maintenance Technician is responsible for performing work orders for corrective and preventive maintenance according to maintenance scheduled,
Job Summary:The Process Engineering Technician is responsible for performing assigned technical tasks, assist with process development and generation of visual
Job DescriptionThis position will interface with wafer fab, mainly NAND and ASIC, package & product design, electrical and physical characterization, lab