OverviewThe Microsoft Silicon team is transforming the ways people communicate, create, and collaborate through the devices and components we develop. We're a
Job Position: PCB Design/ Electronic Design Engineer Job ID: 35024 C(A45) AH Company Background: IT Solution Service Provider Salary Range: Basic MYR5500
In your new role you will: Trouble shoot and diagnose difficult, infrequent problems in systematic approach Monitor OEE & MTBA performance, quality and yield
Support to optimize machine performance and efficiency by using adequate problem solving tool available In your new role you will:Spare parts management on
**KEY RESPONSIBILITIES**- This job requires a full-time senior engineer with strong engineering knowledge and skills in mold and trim and form equipment and
In your new role you will: T- roubleshoot Pre-assembly equipment failures, identify root cause and perform corrective action to meet equipment downtime KPI P-
Responsible to achieve robust, auto-pilot processes & drive for quality & productivity projects.In your new role you will:Monitor process performance indices
**We can't predict what the future holds, but we know TI will have a part in shaping it.**Production Specialists process wafers of different technologies and
Job Position: PCB Design/ Electronic Design Engineer Job ID: 35024 C(A45) AH Company Background: IT Solution Service Provider Salary Range: Basic MYR5,500
Job Description Be involved in the new product development activities from conceptual stage to mass production including:- Preparing new product concept design
Job DescriptionOwns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated
The Impact You'll MakePlans facilities changes for plant, office, and production equipment layouts, working toward economy of operation, maximum use of
Leading in yield & quality improvement and cost reduction activities through data analysis.In your new role you will:Monitor process performance indices on
In your new role you will: Monitor process performance indices on qualified processes an establish good controls Focus on enhancing L1 early detections and
Job Responsibilities: Backend IC packaging turnkey solutions provider that include wafer bumping, wafer sort, assembly and testing. Expanded machine failure
Responsible to develop a robust process and continuously drive improvement in yield and quality to meet KPI.In your new role you will:Support to optimize
Join UCT and be part of the fastest-growing sector in the world! We indirectly touch every semiconductor chip that goes into every smartphone, smart car and
In your new role you will: To sustain, improve the process in order to deliver products to customers at committed functionality, reliability, time, volume and
In your new role you will: To sustain, improve the process in order to deliver products to customers at committed functionality, reliability, time, volume and
**Roles And Responsibilities**:- To perform all assembly job for all parts to meet customer delivery date.- To ensure all parts or component using the right