In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index for package under responsibility Support
In your new role you will:Responsible for wet processes and chip carrier (Development – Manufacturing overarching).Responsible for working with all
In your new role you will: Responsible for self contain improvement in responsible package line Ensure KPIs are met especially on FAR, Yield and DDM Initiate
In your new role you will: Responsible for self contain improvement in responsible package line Ensure KPIs are met especially on FAR, Yield and DDM Initiate
Responsible for process quality on Test equipment/ Test process levelIn your new role you will:Responsible for self contain improvement in responsible package
In your new role you will: Carry out programming tasks for eArchive including Change Requests or projects by following development guidelines and delivering
Job Description In your new role you will: Wire Bond expert, responsible to achieve robust and auto-pilot processes Sustains and continuously improves
In your new role you will: Carry out programming tasks for eArchive including Change Requests or projects by following development guidelines and delivering
In your new role you will: Wire Bond expert, responsible to achieve robust and auto-pilot processes Sustains and continuously improves qualified technologies
In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index for package under responsibility Support
In your new role you will: Yield improvement activities for Die Attach process Sustain and achieve stability index for package under responsibility Support
Quality improvement activities on DDM investigation, disposition and improvementIn your new role you will:Yield improvement activities for Die Attach
Software Development Engineer Salary Range: RM5000 - RM7000 Job Description MAIN OBJECTIVES Deliver new technologies to customers by developing high-quality,
In your new role you will: Quality improvement activities on DDM investigation, disposition and improvement Yield improvement activities for DA process Sustain
Job Description In your new role you will: Quality improvement activities on DDM investigation, disposition and improvement Yield improvement activities for DA
In your new role you will: Perform or guide Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in
In your new role you will: Drive Technology Integration activities to ensure the package fulfill all requirements in the aspect of Process Interaction. Key
In your new role you will: Responsible for wet processes and chip carrier (Development – Manufacturing overarching). Responsible for working with all
Perform daily support to the production for quality and process engineering topicIn your new role you will:Quality improvement activities on DDM investigation,
In your new role you will: Quality improvement activities on DDM investigation, disposition and improvement Yield improvement activities for DA process Sustain